Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding

ABSTRACT

According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.

RELATED APPLICATIONS

This application is continuation of U.S. application Ser. No.12/970,705, filed on Dec. 16, 2010, entitled “OVERMOLDED SEMICONDUCTORPACKAGE WITH A WIREBOND CAGE FOR EMI SHIELDING,” which is a divisionalof U.S. patent application Ser. No. 11/499,285, filed on Aug. 4, 2006,entitled “OVERMOLDED SEMICONDUCTOR PACKAGE WITH A WIREBOND CAGE FOR EMISHIELDING,” which is a continuation-in-part of, and claims benefit ofthe filing date of, U.S. patent application Ser. No. 10/793,618, filedon Mar. 4, 2004, now U.S. Pat. No. 7,198,987, entitled “OVERMOLDEDSEMICONDUCTOR PACKAGE WITH AN INTEGRATED EMI AND RFI SHIELD,” each ofwhich is hereby incorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is generally in the field of semiconductordevices. More particularly, the invention is in the field ofsemiconductor device packaging.

2. Related Art

Portable electronic devices, such as cell phones, typically utilizemulti-component semiconductor modules to provide a high level of circuitintegration in a single molded package. The multi-componentsemiconductor module can include, for example, a semiconductor die and anumber of electronic components, which are mounted on a circuit board.The circuit board including the semiconductor die and electroniccomponents can be encapsulated in a molding process to form anovermolded semiconductor package. To ensure an acceptable level ofperformance in devices such as cell phones, which are required toproperly operate in diverse environments, the overmolded semiconductorpackage must be shielded from Electro-Magnetic Interference (EMI), whichincludes Radio Frequency Interference (RFI). However, semiconductordevice manufacturers are challenged to provide effective EMI shieldingfor an overmolded semiconductor package without increasing the size ofthe package and without substantially increasing packaging cost.

In one approach, EMI shielding is provided a prefabricated metal shield,which is formed over the overmolded semiconductor package. Theprefabricated metal shield typically includes a wall, which is formedaround the overmolded semiconductor package, and a cover, which isattached to the wall and situated a sufficient distance above theovermolded package to avoid interfering with the package. As a result,the prefabricated metal shield undesirably increases the thickness ofthe final overmolded package. Also, the formation of the prefabricatedmetal shield requires an extra process step and additional materials,which significantly increases packaging cost.

In another approach, conductive foam or rubber is applied over theovermolded semiconductor package to absorb and trap EMI. However, theconductive foam or rubber must be applied manually and requires specialmaterials and an extra process, which significantly increases packagingcost. Additionally, the conductive foam or rubber undesirably increasesthe thickness of the final overmolded package.

Thus, there is a need in the art for a cost-effective EMI shield for anovermolded semiconductor package that does not substantially increasepackage thickness.

SUMMARY OF THE INVENTION

The present invention is directed to an overmolded semiconductor packagewith a wirebond cage for EMI shielding. The present invention addressesand resolves the need in the art for a cost-effective EMI shield for anovermolded semiconductor package that does not substantially increasepackage thickness.

According to one exemplary embodiment, an overmolded package includes acomponent situated on a substrate. For example, the component can be anactive device or a passive device. The overmolded package furtherincludes an overmold situated over the component and the substrate. Theovermolded package further includes a wirebond cage situated over thesubstrate and in the overmold, where the wirebond cage surrounds thecomponent, and where the wirebond cage includes a number of wirebonds.The wirebond cage forms an EMI shield around the component.

According to this exemplary embodiment, the overmolded package furtherincludes a conductive layer situated on a top surface of the overmoldand connected to the wirebond cage, where the conductive layer forms anEMI shield over the component. For example, the conductive layer may beconductive ink. For example, each of the wirebonds can have a first andsecond ends and a middle portion, where the first and second ends areconnected to respective bond pads on the substrate and the middleportion is connected to the conductive layer. For example, each of thewirebonds can have first and second ends, where the first end isconnected to a bond pad on the substrate and the second end is connectedto the conductive layer.

According to one embodiment, the invention is a method for achieving theabove-described structure. Other features and advantages of the presentinvention will become more readily apparent to those of ordinary skillin the art after reviewing the following detailed description andaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates a top view of an exemplary overmolded semiconductorpackage in accordance with one embodiment of the present invention.

FIG. 1B illustrates a cross sectional view of the exemplary structure ofFIG. 1A.

FIG. 2A illustrates a top view of an exemplary overmolded semiconductorpackage in accordance with one embodiment of the present invention.

FIG. 2B illustrates a cross sectional view of the exemplary structure ofFIG. 2A.

FIG. 3A illustrates a top view of an exemplary overmolded semiconductorpackage in accordance with one embodiment of the present invention.

FIG. 3B illustrates a cross sectional view of the exemplary structure ofFIG. 3A.

FIG. 4A illustrates a top view of an exemplary overmolded semiconductorpackage in accordance with one embodiment of the present invention.

FIG. 4B illustrates a cross sectional view of the exemplary structure ofFIG. 4A.

FIG. 5 is a flowchart corresponding to exemplary method steps accordingto one embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention is directed to an overmolded semiconductor packagewith a wirebond cage for EMI shielding. The following descriptioncontains specific information pertaining to the implementation of thepresent invention. One skilled in the art will recognize that thepresent invention may be implemented in a manner different from thatspecifically discussed in the present application. Moreover, some of thespecific details of the invention are not discussed in order not toobscure the invention.

The drawings in the present application and their accompanying detaileddescription are directed to merely exemplary embodiments of theinvention. To maintain brevity, other embodiments of the presentinvention are not specifically described in the present application andare not specifically illustrated by the present drawings.

FIG. 1A shows a top view of an exemplary overmolded semiconductorpackage in accordance with one embodiment of the present invention.Certain details and features have been left out of FIG. 1A that areapparent to a person of ordinary skill in the art. Overmoldedsemiconductor package 100, which is also referred to as an “overmoldedpackage” in the present application, includes component 102, bond pads104 a, 104 b, 104 c, and 104 d (hereinafter “bond pads 104 a through 104d”), wirebond cage 106, and conductive layer 108. Wirebond cage 106includes a number of wirebonds, such as wirebonds 110 a and 110 b. It isnoted that only bond pads 104 a through 104 e and wirebonds 110 athrough 110 e are discussed in detail herein to preserve brevity.

As shown in FIG. 1A, component 102 is situated on a substrate (not shownin FIG. 1A). Component 102 can be an active device, such as asemiconductor die, which can include RF circuitry, for example. In oneembodiment, component 102 can be a passive device, such as an inductor.Also shown in FIG. 1A, bond pads 104 a through 104 d are situated on andalong the perimeter of the substrate (not shown in FIG. 1A). Bond pads104 a through 104 d can comprise a metal such as copper or aluminum andcan be formed, for example, by depositing and patterning a layer ofmetal, such as copper or aluminum, and plating the layer of metal withgold. Bond pads 104 a through 104 d can be connected to a referencepotential (not shown in FIG. 1A), which can be any constant DC planethat does not have an AC component.

Further shown in FIG. 1A, respective ends of wirebond 110 a are situatedon bond pads 104 a and 104 b and respective ends of wirebond 110 b aresituated on bond pads 104 c and 104 d. Thus, wirebond 110 a forms a loopthat extends between bond pads 104 a and 104 b and wirebond 110 b formsa loop that extends between bond pads 104 c and 104 d. Wirebonds 110 aand 110 b can comprise gold or other suitable metal, for example. Therespective ends of wirebond 110 a can be attached to bond pads 104 a and104 b and the respective ends of wirebond 110 b can be attached to bondpads 104 c and 104 d by utilizing a suitable bonding process, forexample. Wirebonds 110 a and 110 b form a portion of wirebond cage 106,which extends along the perimeter of the substrate (not shown in FIG.1A).

Also shown in FIG. 1A, conductive layer 108 is situated on an overmold(not shown in FIG. 1A). Conductive layer 108 is also situated overcomponent 102, bond pads 104 a through 104 d, wirebonds 110 a and 110 b,and the substrate (not shown in FIG. 1A). In the present embodiment,conductive layer 108 can comprise a conductive coating, such as aconductive ink, which can include copper, silver, or other conductivemetals. In another embodiment, conductive layer 108 can comprise a layerof copper, aluminum, or other suitable metal. Conductive layer 108 isconnected to a middle portion of each of the wirebonds (e.g. wirebonds110 a and 110 b) in wirebond cage 106. Conductive layer 108 andwirebonds 110 a and 110 b will be further discussed below in relation toFIG. 1B.

Referring now to FIG. 1B, a cross-sectional view is shown of overmoldedsemiconductor package 100 in FIG. 1A along line 1B-1B in FIG. 1A. Inparticular, component 102, bond pads 104 a through 104 d, wirebond cage106, conductive layer 108, and wirebonds 110 a and 110 b correspond tothe same elements in FIG. 1A and FIG. 1B. As shown in FIG. 1B, component102 and bond pads 104 a through 104 d are situated on substrate 114,which can comprise a ceramic material, a laminate material, or othersuitable type of material. Although not shown in FIG. 1B, substrate 114can include a patterned metal layer on top and bottom substrate surfacesand vias, for example.

Also shown in FIG. 1B, the respective ends of wirebond 110 a aresituated on bond pads 104 a and 104 b and middle portion 111 of wirebond110 a is in contact with conductive layer 108. Further shown in FIG. 1B,the respective ends of wirebond 110 b are situated on bond pads 104 cand 104 d and middle portion 113 of wirebond 110 b is in contact withconductive layer 108. Also shown in FIG. 1B, the ends of each wirebond(e.g. wirebonds 110 a and 110 b) are separated by wirebond loop width120 and adjacent wirebonds (e.g. wirebonds 110 a and 110 b) areseparated by wirebond spacing 122. In the embodiment in FIGS. 1A and 1B,wirebond loop width 120 can be different than wirebond spacing 122. Inone embodiment, wirebond loop width 120 can be substantially equal towirebond spacing 122. Wirebond loop width 120 and wirebond spacing 122can each range in value from microns to millimeters, for example. In theembodiment in FIGS. 1A and 1B, wirebond loop width 120 and wirebondspacing 122 can be selected to achieve EMI shielding for a particularfrequency or a particular range of frequencies.

Further shown in FIG. 1B, overmold 116 is situated over component 102,bond pads 104 a through 104 d, and substrate 114 and encapsulateswirebond cage 106, which includes wirebonds 110 a and 110 b. Overmold116 can comprise epoxy or other suitable molding compound and can beformed in a molding process in a manner known in the art. Also shown inFIG. 1B, conductive layer 108 is situated on top surface 118 of overmold116 and situated over component 102, bond pads 104 a through 104 d andsubstrate 114. Conductive layer 108 is also situated over and in contactwith wirebonds 110 a and 110 b. Conductive layer 108 has thickness 124,which can be between 25.0 microns and 50.0 microns, for example. Inother embodiments, thickness 124 can be between 5.0 microns and 100.0microns. Conductive layer 108 has height 126, which refers to thedistance between the top surface of substrate 114 and top surface 118 ofovermold 116. Height 126 can be approximately 1.0 mm, for example.However, height 126 may also be greater or less than 1.0 mm.

In overmolded semiconductor package 100, conductive layer 108 andwirebond cage 106, which are electrically connected together, form anEMI shield for component 102. The EMI shield can be formed duringformation of overmolded semiconductor package 100 by bonding the ends ofwirebonds to respective bond pads, which can be formed on the topsurface of substrate 114. The ends of wirebond 110 a can be bonded torespective bond pads 104 a and 104 b, for example. Overmold 116 can thenbe formed by utilizing a mold compound, such as epoxy, in a moldingprocess as known in the art to cover component 102, the bond pads (e.g.bond pads 104 a through 104 d), and the top surface of substrate 114 andto encapsulate the wirebonds (e.g. wirebonds 110 a and 110 b) that formwirebond cage 106.

Overmold 116 is desirably formed such that the center portion of eachwirebond (e.g. center portions 111 and 113 of respective wirebonds 110 aand 110 b) in wirebond cage 106 is exposed above top surface 118 ofovermold 116. However, overmold 116 may inadvertently cover the centerportions of the wirebonds in wirebond cage 106. In such case, thecovering portion of overmold 116 can be removed from the center portionsof the wirebonds by utilizing a laser abrasion process, a mechanicalmilling process, a diamond polish process, or other suitable process.Conductive layer 108 can then be formed by utilizing a screen printingprocess, spraying process, electroplating process, thermal spraydeposition process, or other suitable process to apply a layer ofconductive ink on top surface 118 of overmold 116 and on the exposedcenter portions of the wirebonds in wirebond cage 106. In an embodimentin which conductive layer 108 comprises a layer of metal, the layer ofmetal can be deposited on top surface 118 of overmold 116 and on theexposed center portions of the wirebonds by utilizing a chemical vapordeposition (CVD) process or other suitable deposition processes.

In the embodiment in FIGS. 1A and 1B, the invention's overmolded packageincludes conductive layer 108, which provides EMI shielding overcomponent 102, and wirebond cage 106, which provides EMI shieldingaround component 102. Thus, in the embodiment in FIGS. 1A and 1B, theinvention utilizes a conductive layer and a wirebond cage to achieve aneffective EMI shield for an overmolded package. For example, in theembodiment in FIGS. 1A and 1B, the invention can provide an EMI shieldbetween a component, such as an active device, inside the overmoldedpackage and the environment outside of the package.

Also, by forming an EMI shield that includes a wirebond cage, whichincludes multiple wirebonds, and a conductive layer, which is formedover an overmold, the invention advantageously achieves an EMI shieldhaving a low manufacturing cost compared to a conventional prefabricatedmetal shield. Additionally, the conductive layer in the invention's EMIshield is significantly thinner than metal utilized to form theconventional prefabricated metal shield. As a result, the invention'sEMI shield results in a thinner overmolded package compared to anovermolded package that includes a conventional prefabricated metalshield.

Furthermore, by utilizing wirebonds to form an EMI shield, the inventionprovides an EMI shield having a flexible design that can more easilyaccommodate variations in package size and has increased scalabilitycompared to a conventional prefabricated metal shield. Moreover, sincewirebonds are significantly thinner than the walls of the conventionalprefabricated metal shield, the invention's EMI shield consumes lessspace in the overmolded package compared to the conventionalprefabricated metal shield.

FIG. 2A shows a top view of an exemplary overmolded semiconductorpackage in accordance to one embodiment of the present invention.Certain details and features have been left out of FIG. 2A that areapparent to a person of ordinary skill in the art. Overmoldedsemiconductor package 200, which is also referred to as an “overmoldedpackage” in the present application, includes components 202 and 203,bond pads 204 a, 204 b, 204 c, and 204 d (hereinafter “bond pads 204 athrough 204 d”), bond pads 205 a, 205 b, 205 c, and 205 d (hereinafter“bond pads 205 a through 205 d”), wirebond cage 206, and conductivelayer 208. Wirebond cage 206 includes wirebond cage section 207, whichincludes wirebonds 210 a and 210 b, and wirebond cage section 209, whichincludes wirebonds 215 a and 215 b. It is noted that only bond pads 204a through 204 d and 205 a through 205 d and wirebonds 210 a, 210 b, 215a, and 215 b are discussed in detail herein to preserve brevity.

As shown in FIG. 2A, components 202 and 203 are situated on a substrate(not shown in FIG. 2A). In the embodiment in FIG. 2A, components 202 and203 can each be an active device, such as a semiconductor die, which caninclude RF circuitry, for example. In one embodiment, component 202 canbe a passive device, such as an inductor, and component 203 can be anactive device, such as a semiconductor die. In another embodiment,components 202 and 203 can each be a passive device. Also shown in FIG.2A, bond pads 204 a through 204 d and 205 a through 205 d are situatedon the substrate (not shown in FIG. 2A) and are substantially similar incomposition and formation to bond pads 104 a through 104 d in FIGS. 1Aand 1B. Bond pads 204 a through 204 d and 205 a through 205 d can beconnected to a reference potential (not shown in FIG. 2A), which can beany constant DC plane that does not have an AC component.

Further shown in FIG. 2A, respective ends of wirebond 210 a are situatedon bond pads 204 a and 204 b and respective ends of wirebond 210 b aresituated on bond pads 204 c and 204 d. Wirebonds 210 a and 210 b aresubstantially similar in composition and formation to wirebonds 110 aand 110 b in FIGS. 1A and 1B. Also shown in FIG. 2A, respective ends ofwirebond 215 a are situated on bond pads 205 a and 205 b and respectiveends of wirebond 215 b are situated on bond pads 205 c and 205 d.Wirebonds 215 a and 215 b are also substantially similar in compositionand formation to wirebonds 110 a and 110 b in FIGS. 1A and 1B. Wirebonds210 a and 210 b form a portion of wirebond cage section 207, whichextends along the perimeter of the substrate (not shown in FIG. 2A), andwirebonds 215 a and 215 b form a portion of wirebond cage section 209,which is situated between components 202 and 203.

Further shown in FIG. 2A, in wirebond cage section 207, the ends of eachwirebond (e.g. wirebond 210 a) are separated by wirebond loop width 220and adjacent wirebonds (e.g. wirebonds 210 a and 210 b) are separated bywirebond spacing 222. In wirebond cage section 209, the ends of eachwirebond (e.g. wirebonds 215 a) are separated by wirebond loop width 221and adjacent wirebonds (e.g. wirebonds 215 a and 215 b) are separated bywirebond spacing 223. In the embodiment in FIG. 2A, wirebond loop width220 can be different than wirebond spacing 222 and wirebond loop width221 can be different than wirebond spacing 223. Also, wirebond loopwidth 220 can be different than wirebond loop width 221 and wirebondspacing 222 can be different than wirebond spacing 223. In oneembodiment, wirebond loop width 220 can be substantially equal to equalto wirebond spacing 222 and wirebond loop width 221 can be substantiallyequal to wirebond spacing 223. Wirebond loop widths 220 and 221 andwirebond spacings 222 and 223 can each range in value from microns tomillimeters, for example. The value of each of wirebond loop widths 220and 221 and wirebond spacings 222 and 223 can be selected to provide EMIshielding for a particular frequency or range of frequencies.

Also shown in FIG. 2A, conductive layer 208 is situated on an overmold(not shown in FIG. 2A) and also situated over components 202 and 203,bond pads 204 a through 204 d and 205 a through 205 d, wirebonds 210 a,210 b, 215 a, and 215 b, and the substrate (not shown in FIG. 2A).Conductive layer 208 is substantially similar in composition andformation to conductive layer 108 in FIGS. 1A and 1B. In the embodimentin FIG. 2A, conductive layer 208 can comprise a conductive coating, suchas a conductive ink. In another embodiment, conductive layer 208 cancomprise a layer of copper, aluminum, or other suitable metal.Conductive layer 208 is connected to a middle portion of each of thewirebonds (e.g. wirebonds 210 a and 210 b) in wirebond cage section 207and connected to a middle portion of each of the wirebonds (e.g.wirebonds 215 a and 215 b) in wirebond cage section 209. Conductivelayer 208 and wirebonds 210 a and 210 b will be further discussed belowin relation to FIG. 2B.

Referring now to FIG. 2B, a cross-sectional view is shown of overmoldedsemiconductor package 200 in FIG. 2A along line 2B-2B in FIG. 2A. Inparticular, components 202 and 203, bond pads 204 a through 204 d,wirebond cage 206, wirebond cage section 207, conductive layer 208, andwirebonds 210 a and 210 b correspond to the same elements in FIG. 2A andFIG. 2B. As shown in FIG. 2B, components 202 and 203 and bond pads 204 athrough 204 d are situated on substrate 214, which is substantiallysimilar in composition to substrate 114 in FIGS. 1A and 1B. Also shownin FIG. 2B, the respective ends of wirebond 210 a are situated on bondpads 204 a and 204 b and middle portion 211 of wirebond 210 a is incontact with conductive layer 208. Further shown in FIG. 2B, therespective ends of wirebond 210 b are situated on bond pads 204 c and204 d and middle portion 213 of wirebond 210 b is in contact withconductive layer 208.

Further shown in FIG. 2B, overmold 216 is situated over components 202and 203, bond pads 204 a through 204 d, and substrate 214 andencapsulates wirebond cage 206, which includes wirebonds 210 a and 210b. Overmold 216 is substantially similar in composition and formation toovermold 116 in FIG. 1B. Also shown in FIG. 2B, conductive layer 208 issituated on top surface 218 of overmold 216 and situated over components202 and 203, bond pads 204 a through 204 d and substrate 214. Conductivelayer 208 is also situated over and in contact with wirebonds 210 a and210 b. Conductive layer 208 is substantially similar in composition,thickness, and formation to conductive layer 108 in FIGS. 1A and 1B.

In overmolded semiconductor package 200, conductive layer 208 andwirebond cage 206, which are electrically connected together, form anEMI shield for components 202 and 203. In the embodiment in FIGS. 2A and2B, the EMI shield, which includes conductive layer 208 and wirebondcage 206, can be formed in a similar manner as the EMI shield in theembodiment in FIGS. 1A and 1B.

In the embodiment in FIGS. 2A and 2B, the invention's overmolded packageincludes conductive layer 208, which provides EMI shielding overcomponents 202 and 203, wirebond cage section 207, which provides EMIshielding around components 202 and 203, and wirebond cage section 209,which provides EMI shielding between components 202 and 203. Thus, inthe embodiment in FIGS. 2A and 2B, the invention utilizes a conductivelayer and wirebond cage sections to advantageously achieve an effectiveEMI shield between two components inside an overmolded package and theenvironment outside of the package and an effective EMI shield betweenthe two components inside the package. The embodiment in FIGS. 2A and 2Balso provides similar advantages as discussed above for the embodimentin FIGS. 1A and 1B.

FIG. 3A shows a top view of an exemplary overmolded semiconductorpackage in accordance to one embodiment of the present invention.Certain details and features have been left out of FIG. 3A that areapparent to a person of ordinary skill in the art. Overmoldedsemiconductor package 300, which is also referred to as an “overmoldedpackage” in the present application, includes component 302, bond pads304 a, 304 b, 304 c, 304 d, and 304 e (hereinafter “bond pads 304 athrough 304 e”), wirebond cage 306, and conductive layer 308. Wirebondcage 304 includes wirebonds 310 a, 310 b, 310 c, 310 d, and 310 e(hereinafter “wirebonds 310 a through 310 e”). It is noted that onlybond pads 304 a through 304 e and wirebonds 310 a through 310 e arediscussed in detail herein to preserve brevity.

As shown in FIG. 3A, component 302 is situated on a substrate (not shownin FIG. 3A). Component 302 can be an active device, such as asemiconductor die with RF circuitry. In one embodiment, component 302can be a passive device, such as an inductor. Also shown in FIG. 3A,bond pads 304 a through 304 e are situated on and along the perimeter ofthe substrate (not shown in FIG. 3A). Bond pads 304 a through 304 e cancomprise a metal such as copper or aluminum and can be formed, forexample, by depositing and patterning a layer of metal, such as copperor aluminum, and plating the layer of metal with gold. Bond pads 304 athrough 304 e can be connected to a reference potential (not shown inFIG. 3A), which can be any constant DC plane that does not have an ACcomponent.

Further shown in FIG. 3A, wirebonds 310 a through 310 e are situated onrespective bond pads 304 a through 304 e and form wirebond cage 306,which surrounds component 302. Wirebonds 310 a through 310 e cancomprise gold or other suitable metal and can be connected to respectivebond pads 304 a through 304 e by using a bonding process, for example.Also shown in FIG. 3A, wirebond spacing 312 refers to the distancebetween adjacent wirebonds (e.g. the distance between wirebonds 310 aand 310 b). Wirebond spacing 312 can range in value from microns tomillimeters. In one embodiment, wirebond spacing 312 can beapproximately 2.5 mm. The value of wirebond spacing 312 can be selectedto provide EMI shielding for a particular frequency or range offrequencies.

Further shown in FIG. 3A, conductive layer 308 is situated on overmold(not shown in FIG. 3A). Conductive layer 308 is also situated overcomponent 302, bond pads 304 a through 304 e, wirebonds 310 a through310 e, and the substrate (not shown in FIG. 3A). Conductive layer 308can comprise a conductive coating, such as a conductive ink, which caninclude copper, silver, or other conductive metals. In anotherembodiment, conductive layer 308 can comprise a layer of copper,aluminum, or other suitable metal. Conductive layer 308 is connected toan end of each of the wirebonds (e.g. wirebonds 310 a through 310 e) inwirebond cage 306.

Referring now to FIG. 3B, a cross-sectional view is shown of overmoldedsemiconductor package 300 in FIG. 3A along line 3B-3B in FIG. 3A. Inparticular, component 302, bond pads 304 a and 304 b, wirebond cage 306,conductive layer 308, wirebonds 310 a and 310 b, and wirebond spacing312 correspond to the same elements in FIG. 3A and FIG. 3B. As shown inFIG. 3B, component 302 and bond pads 304 a and 304 b are situated onsubstrate 314, which can comprise a ceramic material, a laminatematerial, or other suitable type of material. Although not shown in FIG.3B, substrate 314 can include a patterned metal layer on top and bottomsubstrate surfaces and vias, for example.

Also shown in FIG. 3B, overmold 316 is situated over component 302, bondpads 304 a and 304 b, and substrate 314 and encapsulates wirebond cage306, which includes wirebonds 310 a and 310 b. Overmold 316 issubstantially similar in composition and formation as overmold 116 inFIG. 1B. Further shown in FIG. 3B, conductive layer 308 is situated ontop surface 318 of overmold 316 and situated over component 302, bondpads 304 a and 304 b and substrate 314. Conductive layer 308 is alsosituated over and in contact with wirebonds 310 a and 310 b of wirebondcage 306. Conductive layer 308 has thickness 320 and height 322, whichare substantially similar to thickness 124 and height 126 in FIG. 1B,respectively.

Further shown in FIG. 3B, wirebonds 310 a and 310 b of wirebond cage 306are situated between respective bond pads 304 a and 304 b and conductivelayer 308 and also situated in (i.e. encapsulated by) overmold 316. Inparticular, one end of each of wirebonds 310 a and 310 b is bonded torespective bond pads 304 a and 304 b and the other end of each ofwirebonds 310 a and 310 b is in contact with conductive layer 308.

In overmolded semiconductor package 300, conductive layer 308 andwirebond cage 306, which are electrically connected together, form anEMI shield for component 302. The EMI shield can be formed duringformation of overmolded semiconductor package 300 by bonding one end ofeach of the wirebonds (e.g. wirebond 310 a) that form wirebond cage 306to a bond pad (e.g. bond pad 304 a) by using a suitable bonding processas is know in the art. Overmold 316 can then be formed by utilizing amold compound, such as epoxy, in a molding process as known in the artto cover component 302, the bond pads (e.g. bond pads 304 a and 304 b),and the top surface of substrate 314 and to encapsulate the wirebonds(e.g. wirebonds 310 a and 310 b) that form wirebond cage 306.

Overmold 316 is desirably formed such that the unattached ends of thewirebonds (e.g. wirebonds 310 a and 310 b) in wirebond cage 306 areexposed above top surface 318 of overmold 316. However, if overmold 316inadvertently covers the unattached ends of the wirebonds in wirebondcage 306, the unattached wirebond ends can be exposed by utilizing alaser abrasion process, a mechanical milling process, a diamond polishprocess, or other suitable process to remove the covering portion ofovermold 316. Conductive layer 308 can then be formed by utilizing ascreen printing process, spraying process, electroplating process, orthermal spray deposition process to apply a layer of conductive ink ontop surface 318 of overmold 316 and on the exposed ends of the wirebondsin wirebond cage 306. In an embodiment in which conductive layer 308comprises a layer of metal, the layer of metal can be deposited on topsurface 318 of overmold 316 and on the exposed wirebond ends byutilizing a CVD process or other suitable deposition processes.

In the embodiment of the invention in FIGS. 3A and 3B, the invention'sovermolded package includes conductive layer 308, which provides EMIshielding over component 302, and wirebond cage 306, which provides EMIshielding around component 302. Thus, in the embodiment in FIGS. 3A and3B, the invention utilizes a conductive layer and a wirebond cage toachieve an effective EMI shield between a component inside an overmoldedpackage and the environment outside of the package. The embodiment inFIGS. 3A and 3B also provides similar advantages as discussed above forthe embodiment in FIGS. 1A and 1B.

FIG. 4A shows a top view of an exemplary overmolded semiconductorpackage in accordance to one embodiment of the present invention.Certain details and features have been left out of FIG. 4A that areapparent to a person of ordinary skill in the art. Overmoldedsemiconductor package 400, which is also referred to as an “overmoldedpackage” in the present application, includes components 402 and 403,bond pads 404 a, 404 b, 405 a, and 405 b, wirebond cage 406, andconductive layer 408. Wirebond cage 406 includes wirebond cage section407, which includes wirebonds 410 a and 410 b, and wirebond cage section409, which includes wirebonds 415 a and 415 b. It is noted that onlybond pads 404 a, 404 b, 405 a, and 405 b and wirebonds 410 a, 410 b, 415a, and 415 b are discussed in detail herein to preserve brevity.

As shown in FIG. 4A, components 402 and 403 are situated on a substrate(not shown in FIG. 4A). In the embodiment in FIG. 4A, components 402 and403 can each be an active device, such as a semiconductor die, which caninclude RF circuitry, for example. In one embodiment, component 402 canbe a passive device, such as an inductor, and component 403 can be anactive device, such as a semiconductor die. In another embodiment,components 402 and 403 can each be a passive device. Also shown in FIG.4A, bond pads 404 a, 404 b, 405 a, and 405 b are situated on thesubstrate (not shown in FIG. 4A) and are substantially similar incomposition and formation to bond pads 304 a through 3043 in FIG. 3A.Bond pads 404 a, 404 b, 405 a, and 405 b can be connected to a referencepotential (not shown in FIG. 4A), which can be any constant DC planethat does not have an AC component.

Further shown in FIG. 4A, respective ends of wirebonds 410 a and 410 bare situated on bond pads 404 a and 404 b and respective ends ofwirebonds 415 a and 415 b are situated on bond pads 405 a and 405 b.Wirebonds 410 a, 410 b, 415 a, and 415 b are substantially similar incomposition and formation to wirebonds 310 a through 310 e in FIG. 3A.Wirebonds 410 a and 410 b form a portion of wirebond cage section 407,which extends along the perimeter of the substrate (not shown in FIG.4A), and wirebonds 415 a and 415 b form a portion of wirebond cagesection 409, which is situated between components 402 and 403.

Also shown in FIG. 4A, in wirebond cage section 407, adjacent wirebonds(e.g. wirebonds 410 a and 410 b) are separated by wirebond spacing 412.In wirebond cage section 409, adjacent wirebonds (e.g. wirebonds 415 aand 415 b) are separated by wirebond spacing 413. In the embodiment inFIG. 4A, wirebond spacing 412 can be different than wirebond spacing413. In one embodiment, wirebond spacing 412 can be substantially equalto wirebond spacing 413. Wirebond spacing 412 and wirebond spacing 413can range in value from microns to millimeters, for example. The valueof each of wirebond spacings 412 and 413 can be selected to provide EMIshielding for a particular frequency or range of frequencies.

Also shown in FIG. 4A, conductive layer 408 is situated on an overmold(not shown in FIG. 4A) and also situated over components 402 and 403,bond pads 404 a, 404 b, 405 a, and 405 b, wirebonds 410 a, 410 b, 415 a,and 415 b, and the substrate (not shown in FIG. 4A). Conductive layer408 is substantially similar in composition and formation to conductivelayer 308 in FIGS. 3A and 3B. In the embodiment in FIG. 4A, conductivelayer 408 can comprise a conductive coating, such as a conductive ink.In another embodiment, conductive layer 408 can comprise a layer ofcopper, aluminum, or other suitable metal. Conductive layer 408 isconnected to an end of each of the wirebonds (e.g. wirebonds 410 a and410 b) in wirebond cage section 407 and connected to an end of each ofthe wirebonds (e.g. wirebonds 415 a and 415 b) in wirebond cage section409. Conductive layer 408 and wirebonds 410 a and 410 b will be furtherdiscussed below in relation to FIG. 4B.

Referring now to FIG. 4B, a cross-sectional view is shown of overmoldedsemiconductor package 400 in FIG. 4A along line 4B-4B in FIG. 4A. Inparticular, components 402 and 403, bond pads 404 a and 404 b, wirebondcage 406, wirebond cage section 407, conductive layer 408, wirebonds 410a and 410 b, and wirebond spacing 412 correspond to the same elements inFIG. 4A and FIG. 4B. As shown in FIG. 4B, components 402 and 403 andbond pads 404 a and 404 b are situated on substrate 414, which issubstantially similar in composition to substrate 314 in FIGS. 3A and3B. Also shown in FIG. 4B, wirebonds 410 a and 410 b are situatedbetween respective bond pads 404 a and 404 b and conductive layer 408.

Further shown in FIG. 4B, overmold 416 is situated over components 402and 403, bond pads 404 a and 404 b, and substrate 414 and encapsulateswirebond cage 406, which includes wirebonds 410 a and 410 b. Overmold416 is substantially similar in composition and formation to overmold316 in FIG. 3B. Also shown in FIG. 4B, conductive layer 408 is situatedon top surface 418 of overmold 416 and situated over components 402 and403, bond pads 404 a and 404 b and substrate 414. Conductive layer 408is also situated over and in contact with wirebonds 410 a and 410 b andis substantially similar in composition, thickness, and formation toconductive layer 308 in FIGS. 3A and 3B.

In overmolded semiconductor package 400, conductive layer 408 andwirebond cage 406, which are electrically connected together, form anEMI shield for components 402 and 403. In the embodiment in FIGS. 4A and4B, the EMI shield, which includes conductive layer 408 and wirebondcage 406, can be formed in a similar manner as the EMI shield in theembodiment in FIGS. 3A and 3B.

In the embodiment in FIGS. 4A and 4B, the invention's overmolded packageincludes conductive layer 408, which provides EMI shielding overcomponents 402 and 403, wirebond cage section 407, which provides EMIshielding around components 402 and 403, and wirebond cage section 409,which provides EMI shielding between components 402 and 403. Thus, inthe embodiment in FIGS. 4A and 4B, the invention utilizes a conductivelayer and wirebond cage sections to advantageously achieve an effectiveEMI shield between two components inside an overmolded package and theenvironment outside of the package and an effective EMI shield betweenthe two components inside the package. The embodiment in FIGS. 4A and 4Balso provides similar advantages as discussed above for the embodimentin FIGS. 1A and 1B.

FIG. 5 shows a flowchart illustrating an exemplary method according toone embodiment of the present invention. Certain details and featureshave been left out of flowchart 500 that are apparent to a person ofordinary skill in the art. For example, a step may consist of one ormore substeps or may involve specialized equipment or materials, asknown in the art. At step 502, bond pads are formed on a substrate thatincludes one or more components and wirebonds are attached to the bondpads to form a wirebond cage. For example, bonds pads 104 a through 104d in FIG. 1B can be formed on substrate 114, which includes component102, by depositing and patterning a layer of copper, aluminum, or othersuitable metal. For example, wirebonds 110 a and 110 b can be attachedto respective bond pads 104 a and 104 b and bond pads 104 c and 104 d byusing a suitable bonding process to form wirebond cage 106.

At step 504, an overmold is formed over one or more components, thewirebond cage, the bond pads, and the substrate. For example, overmold116 in FIG. 1B, which can comprise an epoxy molding compound, can beformed over component 102, wirebond cage 106, which includes wirebonds110 a and 110 b, bond pads 104 a through 104 d, and substrate 114 in amolding process in a manner known in the art. At step 506, a conductivelayer is formed on a top surface of the overmold such that theconductive layer is in contact with the wirebond cage. For example,overmold 116 can be formed such that middle portions 111 and 113 ofrespective wirebonds 110 a and 110 b are exposed. Conductive layer 108in FIG. 1B can then be formed by applying a conductive ink over exposedmiddle portions 111 and 113 of respective wirebonds 110 a and 110 b andon top surface 118 of overmold 116. The conductive ink can be applied byutilizing a spraying process, electroplating process, thermal spraydeposition process, or other suitable process, for example.

As a result of the process in flowchart 500, an EMI shield, whichincludes the wirebond cage and the conductive layer, is formed in anovermolded package. For example, an EMI shield, which includes wirebondcage 106 and conductive layer 108, which are electrically connectedtogether, is formed in overmolded semiconductor package 100 in FIGS. 1 Aand 1B.

Thus, as discussed above, in the embodiments in FIGS. 1A, 1B, 2A, 2B,3A, 3B, 4A, and 4B, the invention utilizes a conductive layer and awirebond cage to advantageously achieve an effective EMI shield betweenone or more components inside an overmolded package and the environmentoutside of the package. Additionally, in the embodiments in FIGS. 2A,2B, 4A, and 4B, the invention utilizes a wirebond cage section toachieve an effective EMI shield between two components inside thepackage. Furthermore, in the embodiments in FIGS. 1A, 1B, 2A, 2B, 3A,3B, 4A, and 4B, the invention advantageously achieves an effective EMIshield for an overmolded package that has a flexible design, is costeffective, and does not substantially increase the size of theovermolded package.

From the above description of the invention it is manifest that varioustechniques can be used for implementing the concepts of the presentinvention without departing from its scope. Moreover, while theinvention has been described with specific reference to certainembodiments, a person of ordinary skill in the art would appreciate thatchanges can be made in form and detail without departing from the spiritand the scope of the invention. Thus, the described embodiments are tobe considered in all respects as illustrative and not restrictive. Itshould also be understood that the invention is not limited to theparticular embodiments described herein but is capable of manyrearrangements, modifications, and substitutions without departing fromthe scope of the invention.

Thus, an overmolded semiconductor package with wirebond cage for EMIshielding has been described.

What is claimed is:
 1. A method for fabricating a packaged module, themethod comprising: providing a packaging substrate having a referencepotential layer; mounting one or more components on a surface of thepackaging substrate; forming a plurality of wirebonds on the packagingsubstrate so as to define a perimeter around and substantially surroundthe one or more components, each of the plurality of wirebonds having afirst end, a second end, and a middle portion, the first and second endselectrically connected to the reference potential layer and separated bya wirebond loop width, wirebonds along the perimeter separated by awirebond spacing, the wirebond loop width and the wirebond spacingselected to provide electromagnetic shielding for a particular range offrequencies; forming an overmold that substantially encapsulates the oneor more components and the plurality of wirebonds, the overmoldincluding an upper surface where the middle portions of the plurality ofwirebonds are exposed; and forming a conductive layer on the uppersurface of the overmold so as to be in electrical contact with themiddle portions of the plurality of wirebonds, the conductive layer incombination with the plurality of wirebonds and the reference potentiallayer providing the electromagnetic shielding.
 2. The method of claim 1wherein the combination of the conductive layer, the plurality ofwirebonds, and the reference potential layer provides theelectromagnetic shielding between the one or more components and anexterior of a volume defined by the overmold above the surface of thepackaging substrate.
 3. The method of claim 2 wherein the conductivelayer, the plurality of wirebonds, and the reference potential layer aredimensioned to provide electromagnetic shielding between interior andexterior locations of the volume.
 4. The method of claim 1 wherein thepackaging substrate includes a laminate substrate.
 5. The method ofclaim 1 wherein the mounting of one or more components includes mountinga semiconductor die having a radiofrequency (RF) circuitry.
 6. Themethod of claim 1 wherein the mounting of one or more componentsincludes mounting a discrete electronic device.
 7. The method of claim 6wherein the discrete electronic device includes a passive device.
 8. Themethod of claim 1 wherein the first and second ends are electricallyconnected to the reference potential layer through bond pads on thesurface of the packaging substrate.
 9. The method of claim 1 wherein theforming of the plurality of wirebonds includes forming a plurality ofcurved wirebonds, each curved wirebond having the first and second endsthat begin and end at the surface of the packaging substrate,respectively.
 10. The method of claim 9 wherein at least one of thefirst and second ends of the curved wirebond is attached to a bond padon the surface of the packaging substrate.
 11. The method of claim 9wherein the curved wirebond has a loop shape such that the middleportion of the wirebond is at a point or a segment of the wirebondbetween the first and second ends.
 12. The method of claim 9 whereineach of the curved wirebonds defines a plane that is approximatelynormal to a plane defined by the surface of the substrate.
 13. Themethod of claim 12 wherein the curved wirebonds are arranged such thattheir planes extend along the perimeter about the one or morecomponents.
 14. The method of claim 13 wherein the perimeter defines arectangular shape.
 15. The method of claim 1 wherein the forming of theovermold includes: providing a molding compound such that the moldingcompound encapsulates the one or more components and the plurality ofwirebonds to a height that is greater than heights of at least some ofthe wirebonds; and removing a top portion of the molding compound so asto yield the upper surface of the overmold and expose the middleportions of the wirebonds including the at least some of the wirebondsthat were covered by the molding compound.
 16. The method of claim 15wherein the removing of top portion includes a mechanical removalprocess.
 17. The method of claim 1 wherein the forming of the conductivelayer includes a spraying process so as to yield the conductive layer.18. A method for manufacturing a portable radio-frequency (RF) device,the method comprising: providing a circuit board; and mounting apackaged device on the circuit board, the packaged device including apackaging substrate having a surface and including a reference potentiallayer at or below the surface, at least one semiconductor die mounted onthe surface of the packaging substrate, a plurality of wirebondsdisposed on the surface of the packaging substrate and arranged todefine a perimeter around and substantially surround the at least onesemiconductor die, each of the plurality of wirebonds having a firstend, a second end, and a middle portion, the first and second endselectrically connected to the reference potential layer and separated bya wirebond loop width, wirebonds along the perimeter separated by awirebond spacing, the wirebond loop width and the wirebond spacingselected to provide electromagnetic shielding for a particular range offrequencies, an overmold that substantially encapsulates the at leastone semiconductor die and the plurality of wirebonds, the overmoldincluding an upper surface where the middle portions of the plurality ofwirebonds are exposed, and a conductive layer disposed on the uppersurface of the overmold so as to be in electrical contact with themiddle portions of the plurality of wirebonds, the conductive layer incombination with the plurality of wirebonds and the reference potentiallayer providing the electromagnetic shielding.
 19. The method of claim18 wherein the RF device includes a cellular phone.
 20. A method offorming an overmolded package, the method comprising: forming a wirebondcage around a component situated on a substrate, the wirebond cageincluding a plurality of wirebonds and defining a perimetersubstantially surrounding the component, each of the plurality ofwirebonds having a first end, a second end and a middle portion, each ofthe first and second ends electrically connected to a referencepotential layer below a surface of the substrate and separated by awirebond loop width, wirebonds along the perimeter separated by awirebond spacing; selecting the wirebond loop width and the wirebondspacing to provide electromagnetic shielding for a particular range offrequencies; forming an overmold over the component, the wirebond cage,and the substrate, the overmold encapsulating the wirebond cage so as todefine an upper surface where the middle portions of at least some ofthe plurality of wirebonds are exposed; and forming a conductive layeron the upper surface of the overmold so as to be in electrical contactwith the exposed middle portions of the at least some of the pluralityof wirebonds, the conductive layer in combination with the wirebond cageand the reference potential layer providing the electromagneticshielding for the selected range of frequencies.
 21. The method of claim20 wherein the wirebond cage in electrical contact with the referencepotential layer and the conductive layer in electrical contact with thewirebond cage through the exposed middle portions of the at least someof the plurality of the wirebonds forms an EMI shield over the componentand an exterior of a volume defined by the overmold above the surface ofthe substrate.
 22. The method of claim 21 wherein the first and secondends are electrically connected to the reference potential layer throughbond pads situated on the substrate.
 23. The method of claim 22 whereinthe bond pads are substantially aligned along the perimeter.